Publications
A. Journal Papers
A1. C. Wan, T. K. Gaylord, and M. S. Bakir, “Grating design for interlayer optical interconnection of in-plane waveguides,” Appl. Opt. vol. 55, no. 10, pp. 2601-2610, 2016. PDF Featured on the journal cover (Ph.D. Project 1)
A2. C. Wan, T. K. Gaylord, and M. S. Bakir, “RCWA-EIS method for interlayer grating coupling,” Appl. Opt. vol. 55, no. 22, pp. 5900-5908, 2016. PDF (Ph.D. Project 1)
A3. C. Wan, T. K. Gaylord, and M. S. Bakir, “Rigorous coupled-wave analysis equivalent-index-slab method for analyzing 3D angular misalignment in interlayer grating couplers,” Appl. Opt. vol. 55, no. 35, pp. 10006-10015, 2016. PDF (Ph.D. Project 1)
A4. C. Wan, T. K. Gaylord, and M. S. Bakir, “Circular waveguide grating-via-grating for interlayer coupling,” IEEE Photon. Technol. Lett., vol. 29, no. 21, pp. 1776-1779, 2017. PDF (Ph.D. Project 2)
A5. C. Wan, T. K. Gaylord, and M. S. Bakir, “Grating-assisted-cylindrical-resonant-cavities interlayer coupler,” Appl. Opt. vol. 57, no. 18, pp. 5079-5089, 2018. PDF (Ph.D. Project 2)
A6. C. Wan, J. L. Gonzalez, T. Fan, A. Adibi, T. K. Gaylord, and M. S. Bakir, “Fiber-interconnect silicon chiplet technology for self-aligned fiber-to-chip assembly,” IEEE Photon. Technol. Lett., vol. 31, no. 16, pp. 1311-1314, 2019. PDF (Ph.D. Project 3)
A7. X. Pang, C. Wan, M. Wang, and Z. Lin, “Strictly biphasic soft and hard Janus structures: synthesis, properties, and applications,” Angew. Chem. Int. Ed., vol. 53, no. 22, pp. 5524-5538, 2014. PDF (M.S. Project)
B. Conference Papers
B1. C. Wan, T. K. Gaylord, and M. S. Bakir, “Grating design for 3-D interconnections of waveguides in overlaid chips using the RCWA-EIS method,” in Frontiers in Optics (Optical Society of America, 2016), paper JW4A. 127. PDF
B2. C. Wan, T. K. Gaylord, and M. S. Bakir, “Waveguide grating couplers in overlaid chips: efficiency optimization and angular misalignment simulation,” in Frontiers in Optics (Optical Society of America, 2017), paper JW4A. 94. PDF
B3. C. Wan, T. K. Gaylord, and M. S. Bakir, “Si/SiO2 interlayer coupler based on cylindrical resonant cavities,” in IEEE Research and Applications of Photonics In Defense Conference (IEEE, 2018), invited. PDF
C. Book Chapter
C1. M. Zia, C. Wan, Y. Zhang, and M. S. Bakir, “Electrical and photonic off-chip interconnection and system integration,” in Optical Interconnects for Data Centers, T. Tekin, R. Pitwon, A. Hakansson, and N. Pleros. (Elsevier, 2016), pp. 265-283.
D. Master’s Thesis
D1. “Functional nanoparticles: synthesis and simulation,” Georgia Institute of Technology, 2014. PDF
E. Ph.D.’s Thesis
E1. “Optical coupler design and experimental demonstration for 2.5D/3D heterogeneous integrated electronics,” Georgia Institute of Technology, 2019. PDF
F. Intellectual Property:
F1. Circular waveguide grating-via-grating for interlayer coupling, U.S. Patent Application No. 62/557,240.
F2. Fiber-interconnect silicon chiplet technology for self-aligned fiber-to-chip assembly, U.S. Patent Application No. 62/808,378.